I measured the gap to be just a little bit higher than 0.15mm (I couldn’t fit the 0.2 filler gauge). So I tried to shim it with something, aluminum foil is definitely not enough you would need more than 10 layers. So the closest thing I had was a Coke can, I cut a square piece and remove the paint and inner coating with steel wool, trim it to 14x14mm.

it turned out to be 0.1mm, (don’t use 2 layers it will be too thick). add thermal paste to both sides. So the thermal paste only has to fill a gap about 0.025 on each side instead of a massive 0.2 gap.

The platform chip is sitting around 10°C colder than the CPU.

I posted photos here:

https://gist.github.com/victornpb/ae16f3...

I ended up using a shim made out of a soda can. I posted photos here:

https://gist.github.com/victornpb/ae16f3...

When reinstalling the heatsink the Platform controller chip has a huge gap, so you have to either use a thermal pad, ton of thermal paste or shim the gap. I ended up using a shim made out of a soda can. I posted photos here:

https://gist.github.com/victornpb/ae16f3...

This is how I fixed it https://gist.github.com/victornpb/ae16f3...

No they are just spring loaded fingers used to ground the heatsink.

On mine the screw in orange is hidden under a black EMI shielding tape. You have to peel it first

I noticed this too

Mine is:

2 bands = CH0

1 bands = CH1

0 bands = CH2

Model: AR5BXB112

I opened 2 iPhones, one is a 3G and other is a 3GS, both doesn't have the lock, just a slot without any lock, the ribbon cable detach easily, and both is working fine. I can open it again and take a picture.

Don't try to unlock the cable 3 THERE'S NO LOCK on the cable 3 on my iPhone 3GS, just slide the cable upside. Almost broke mine, don't try to "unlock", there's no lock actually!