Stap 5 vertalen
Stap 5
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A quick analysis of the BGA voiding in the Apple 338S120L shows voids as large as 35%. That does not mean this is a problem, but certainly something a quality manager would need to check and validate. Besides, none of the other surface mount components in the iPhone 5S have this level of voiding.
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The BGA inspector allows us to visualize the void in a 3D representation of x-y and density as the height of the volume.
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