tipoo

Nice work gang. Re: Improved battery monitoring, can you confirm if Apple ditched the Dialog power IC and made their own as was rumored?

Only result for SK Hynix H9HKNNNCRMMVDR-NEH seems to be ifixit itself…Alas, RAM debate not yet put to rest!

Is the LCD fused to the touch digitizer here? Wondering if I can just get the LCD, or need the complete assembly, because my touch layer still works, just the LCD is cracked

“When comparing these FTIR spectra to that of known polymers, the closest match for the 2018 model is polyacetylene with aromatic urethane side groups, while the 2019 model uses polyamide (commonly known as nylon).

What this doesn't tell us is, just what problem Apple's engineers tried to solve using this updated material. Send us your ideas!”

Spitballing, any debris would have an easier time sliding through the nylon, while the 2018 model has a more sticky material.

Interesting, confirms what I thought in their render that showed the insides, that the fan was too close to the back for their usual spacing for a heatsink there. Looks like the fan just ambiently cools the chassis and moves internal air, rather than directly passes over a heatsink.

Looks to me like the black pads would act as a shock absorber of sorts for the SiP to move against in a bang, sorta like jewel shock absorbers in mechanical watches.

Wonder how long it takes to charge that XS Max battery on the included 5W brick (it’s not 12/5 exactly, since it slows down towards the last 20%). Come on now Apple, it’s time to include fast chargers.

Dittoing the VRM comment, there’s been some interesting speculation that it’s the VRMs that are underspecced and overheating before the i9 does.

That bluetooth chip appears to support 4.0, while the pre-slim PS4s controllers only used 2.1 (and had a lot of interference)? Does anyone know if using the V2 DS4 would form a 4.0 link? Was it just controller side that didn’t support 4.1?

http://www.marvell.com.cn/wireless/asset...

It's interesting, isn't it, that they dedicate significant internal space to that heat pipe for better thermal management. However even so, neither chip (I assume, more testing needed) catches the A11s sustained performance over time. Makes me wonder what improvement that heat pipe would show in the A11. And makes me want an actively cooled A11X clamshell….