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| - | [* black] And on the ~~even darker~~ rear side a huge copper |
|---|---|
| - | [* red] [link|https://www.qualcomm.com/products/snapdragon-888-5g-mobile-platform|Qualcomm SM8350 Snapdragon 888 (5 nm)|new_window=true] |
| - | [* orange] SK Hynix |
| + | [* black] And on the ~~even darker~~ rear side, a huge expanse of copper conceals these tiny bits of silicon: |
| + | [* red] [link|https://www.qualcomm.com/products/snapdragon-888-5g-mobile-platform|Qualcomm SM8350 Snapdragon 888 (5 nm)|new_window=true] with integrated X60 modem, layered underneath LPDDR5 3200MHz |
| + | [* orange] SK Hynix HN8T05BZGK 128GB flash memory chip UFS 3.1 |
| [* green] Wi-Fi/BT 5.2 WCN 6851 Wi-Fi 6 wireless combo SoC | |
| - | [* yellow] Qualcomm |
| - | [* light_blue] Qualcomm |
| - | [* blue] Nuvolta |
| - | [* violet] |
| + | [* yellow] Qualcomm SDR868-RF transceiver chip |
| + | [* light_blue] Qualcomm SMB1396 fast charging chip |
| + | [* blue] Nuvolta NU1619A wireless power receiving chip |
| + | [* violet] Qorvo QM77033D front-end module |