What thermal paste to use after bottom board swap?
Hi guys,
Last night I did a bottom board swap on iPhone X (tried it for the first time and succeeded, very proud of myself :D). After I soldered both logic boards back together I have realised there is no thermal compound inside anymore. I want to do my repairs to the highest possible standards, so I think it's a good idea to apply some thermal paste back where it should be.
My question is what product do you use for it? What type of paste?
Thanks,
Marcin
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