I had major difficulty removing the back panel.
I’m unsure if there was a crack prior to removal of the back panel as the attempt to use the suction and pry tool had catastrophically failed. Huge cracks sprawled as the pry tool was inserted, quite a bit of force was necessary to have the pry tool inserted whilst awkwardly positioning my hands to hold the phone down whilst pulling up on the suction tool. I had used heat tools to ease the adhesive behind the panel but may have lost patience as the heat bags provided does not seem to have the same effect as a heat gun would. That being said, the heat bags, while they heat up I’m unsure if they heat up to the critical temperature of the adhesive for it to weaken.
further instruction for the temperature of the bags would help; what is the max temperature I can warm the bag up before it fails (explodes in the microwave) while meeting minimum temperature required to ease the adhesive. currently it said to warm it up for 30sec, 1 every 10 mins, doesn’t cut it.
Zodra ze een reputatiescore hebben bent je in staat om een grafiek te zien van het verloop hiervan.
Hier is een voorbeeld van hoe de grafiek eruitziet:
Nog geen reputatiescore gekregen.