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Demontage van de iPhone 13 Pro

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Nederlands
Stap 7
iPhone 13 Pro Teardown: stap 0, afbeelding 1 van 2 iPhone 13 Pro Teardown: stap 0, afbeelding 2 van 2
  • The layered logic board is even teensier this year, and unfortunately the SIM card reader is now baked onto the board (booo!). In any case, let's see what chips are lying on the surface:

  • Apple APL1W07 A15 Bionic SoC layered with what's most likely 6 GB of SK Hynix LPDDR4X SDRAM

  • Apple/USI U1 ultra-wideband chip

  • Apple APL1098 power management IC

  • Skyworks SKY58276-17 front-end module

  • Skyworks SKY58271-19 front-end module

  • Apple 338S00770-B0 power management IC

  • STMicroelectronics STB601A05 power management IC

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+[* black] The layered logic board is even teensier this year, and unfortunately the SIM card reader is now baked onto the board (booo!). In any case, let's see what chips are lying on the surface:
+ [* red] Apple APL1W07 A15 Bionic SoC layered with what's most likely 6 GB of SK Hynix LPDDR4X SDRAM
+ [* orange] Apple/USI U1 ultra-wideband chip
+ [* yellow] Apple APL1098 power management IC
+ [* green] Skyworks SKY58276-17 front-end module
+ [* light_blue] Skyworks SKY58271-19 front-end module
+ [* blue] Apple 338S00770-B0 power management IC
+ [* violet] STMicroelectronics STB601A05 power management IC

Je bijdragen zijn gelicentieerd onder de open source Creative Commons-licentie.