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A look inside the Panasonic RZ-S50W (Japan) / RZ-S500W (Outside Japan) Bluetooth Headphones

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  1. Features: Exceptional Sound and Noise Cancellation.  Multiple MEMS microphones Optimum Sound Isolation
    • Features:

    • Exceptional Sound and Noise Cancellation. Multiple MEMS microphones

    • Optimum Sound Isolation

    • Strong, Stable Connection

    • High-Quality Calling Sound

    • Approximately, 6 hours playback, and up to 20 Hours of use with charger

    • Bluetooth® 5.0

    • Capacitive touch sensor control

  2. What is in the box Headphones / Charging Case USB 'C' Cable
    • What is in the box

    • Headphones / Charging Case

    • USB 'C' Cable

    • Headphone rubber tips for different sizes of ears

    • User's Manual

  3. Charging case with headphones Close up view of headphones Close up view of headphones
    • Charging case with headphones

    • Close up view of headphones

  4. Side views of Headphone MEMS Microphones Speaker Spatial Vent Port
    • Side views of Headphone

    • MEMS Microphones

    • Speaker Spatial Vent Port

    • Speaker Sound Port

    • Speaker Vent

    • USB Interface

    • Charger Interface

    • Vent Port

  5. View of Headphone with rubber ear piece [cap] removed
    • View of Headphone with rubber ear piece [cap] removed

    • Vent Port

  6. Since the Panasonic Headphone enclosure is glued together, the only way in was to cut into the headphone. This is a destructive teardown A Razsor Knife was use to cut into the Panasonic headphone along the seam in the headphone.  Then a Jimmy Tool was used to open up the headphone
    • Since the Panasonic Headphone enclosure is glued together, the only way in was to cut into the headphone.

    • This is a destructive teardown

    • A Razsor Knife was use to cut into the Panasonic headphone along the seam in the headphone. Then a Jimmy Tool was used to open up the headphone

    • Once opened, we get our first look at the inside of the headphone

  7. Opening up the headphone, we can see the main PCB, Battery, Speaker, etc. Tweezers and a Pick Tool were used to removed the electronics from the enclosure Double sided foam tape was used to hold the main the PCB to the Battery and to the Touch Sensor / Antenna PCB.  This foam tape had to be cut free. Then Denatured Alcohol was used to remove the foam tape glue from the PCBs and Battery Battery
    • Opening up the headphone, we can see the main PCB, Battery, Speaker, etc. Tweezers and a Pick Tool were used to removed the electronics from the enclosure

    • Double sided foam tape was used to hold the main the PCB to the Battery and to the Touch Sensor / Antenna PCB. This foam tape had to be cut free. Then Denatured Alcohol was used to remove the foam tape glue from the PCBs and Battery

    • Battery

    • Main PCB

    • Speaker Area

    • Touch Sensor and Antenna

    • Double Sided Foam Tape

  8. SLA DE UPGRADE OVER

    Bespaar door het te repareren met een alles-in-één kit.

    Koop iPhone-reparatiekits

    SLA DE UPGRADE OVER

    Bespaar door het te repareren met een alles-in-één kit.

    Koop iPhone-reparatiekits
  9. At first, I wasn't sure about the solder balls. Then I realized they are used to anchor the USB and Power Interface pins on the outside of the Headphone to the internal circuit board. I had to used a soldering iron to remove the solder balls, so that the internal interface circuit board could be removed.  I had to also remove solder from the speaker wires to free up the internal circuit board. The internal circuit board was also attached a MEMS Microphone that appeared to be monitoring the Speaker Chamber of the Headphone, since it was faced in.   I had to remove the outside panel with 'R' on it with a Razor Knife to free the MEMS Microphone. Once the MEMS Microphone was freed, the interface circuit board could be pulled out
    • At first, I wasn't sure about the solder balls. Then I realized they are used to anchor the USB and Power Interface pins on the outside of the Headphone to the internal circuit board.

    • I had to used a soldering iron to remove the solder balls, so that the internal interface circuit board could be removed. I had to also remove solder from the speaker wires to free up the internal circuit board.

    • The internal circuit board was also attached a MEMS Microphone that appeared to be monitoring the Speaker Chamber of the Headphone, since it was faced in. I had to remove the outside panel with 'R' on it with a Razor Knife to free the MEMS Microphone. Once the MEMS Microphone was freed, the interface circuit board could be pulled out

    • USB and Power (Charger) Interface

    • MEMS Microphone

    • Sound Ports

    • Speaker Wires

    • Internal Circuit Board that interface Power and USB to the Headphones

  10. There was not much to see on the internal interface board.  The was one IC component that could not be crossed. If you happen to know the component, please leave a comment below Unknown Component Unknown Component
    • There was not much to see on the internal interface board. The was one IC component that could not be crossed. If you happen to know the component, please leave a comment below

    • Unknown Component

  11. Full Sensor Flex/Charging PCB IC Identification: You may need to enlarge the picture to view the text.
    • Full Sensor Flex/Charging PCB IC Identification:

    • You may need to enlarge the picture to view the text.

  12. Next the Speaker sound chamber cover was removed with the use of a Pick Tool and Tweezers. A Razor Knife was used to cut the glue holding the speak in place The speaker had no identifiable markings With Speaker removed, we can see the sound chamber and sound ports
    • Next the Speaker sound chamber cover was removed with the use of a Pick Tool and Tweezers. A Razor Knife was used to cut the glue holding the speak in place

    • The speaker had no identifiable markings

    • With Speaker removed, we can see the sound chamber and sound ports

  13. Closeup view of the Battery Li-Ion 3.7V, 0.32Wh
  14. Closeup view of the Antenna/Touch Sensor side of the Main PCB DSP Group - C2A1A Hybrid Active Noise Cancellation (ANC) Codec and Audio Digital Signal Processor (DSP)
    • Closeup view of the Antenna/Touch Sensor side of the Main PCB

    • DSP Group - C2A1A Hybrid Active Noise Cancellation (ANC) Codec and Audio Digital Signal Processor (DSP)

    • 651DF1M9 - Could not cross part number, but during a web search found out that it may be an integrated battery management IC

    • W25Q32JWUUIMTR- SPI FLASH 32Mb

    • MEMS Microphone Port

  15. Closeup view of some of the components on the Antenna/Touch Sensor side of the Main PCB DSP Group - C2A1A Hybrid Active Noise Cancellation (ANC) Codec and Audio Digital Signal Processor (DSP) W25Q32JWUUIMTR- SPI FLASH 32Mb
    • Closeup view of some of the components on the Antenna/Touch Sensor side of the Main PCB

    • DSP Group - C2A1A Hybrid Active Noise Cancellation (ANC) Codec and Audio Digital Signal Processor (DSP)

    • W25Q32JWUUIMTR- SPI FLASH 32Mb

    • 651DF1M9 - Could not cross part number, but during a web search found out that it may be an integrated battery management IC

  16. Battery side close up view of the Main PCB AIROHA AB1552 - ARM Cortex M4/Bluetooth 5.0 Dual Mode
    • Battery side close up view of the Main PCB

    • AIROHA AB1552 - ARM Cortex M4/Bluetooth 5.0 Dual Mode

    • 927 MPS1 MEMS Microphone. The Headphone uses three MEMS microphones with this part number

    • Could not cross the part number. If you know the part, please leave a comment below. The 2D bar code on the part reads as STM927352NH2S011

    • Crystal Oscillator

    • Unknown component. Labelled B2A. Please leave a comment if you happen to know this component

    • Unknown component. Labelled SV4CP 240. Please leave a comment if you happen to know this component. Separated from PCB during teardown

  17. Closeup view of some of the components on the Battery side of the Main PCB AIROHA AB1552 - ARM Cortex M4/Bluetooth 5.0 Dual Mode 927 MPS1 MEMS Microphone.  The Headphone uses three of these MEMS microphones
    • Closeup view of some of the components on the Battery side of the Main PCB

    • AIROHA AB1552 - ARM Cortex M4/Bluetooth 5.0 Dual Mode

    • 927 MPS1 MEMS Microphone. The Headphone uses three of these MEMS microphones

    • Could not cross the part number. If you know the part, please leave a comment below. The 2D bar code on the part reads as STM927352NH2S011

    • Unknown component. Labelled B2A. Please leave a comment if you happen to know this componentNew line.

  18. Closeup view of top and bottom side of the Touch Sensor Flex PCB and PCB Antenna Closeup view of top and bottom side of the Touch Sensor Flex PCB and PCB Antenna
    • Closeup view of top and bottom side of the Touch Sensor Flex PCB and PCB Antenna

  19. Full Main PCB IC Identification: You may need to enlarge the picture to view the text.
    • Full Main PCB IC Identification:

    • You may need to enlarge the picture to view the text.

  20. Predicted Block Diagram of the Panasonic RZ-S50W Bluetooth Headphones:
    • Predicted Block Diagram of the Panasonic RZ-S50W Bluetooth Headphones:

    • You may need to enlarge the picture to view the text.

  21. Teardown Exploded View of the Panasonic Headphone Teardown Exploded View of the Panasonic Headphone
    • Teardown Exploded View of the Panasonic Headphone

Robert Shuler

Lid sinds: 12-03-19

1.705 Reputatie

8 handleidingen geschreven

If you can, can you post the teardown of the charging case too?

Chunglin Chin - Antwoord

Dong a web search, I believe the glue removed from the speaker was a silicone dome used to help compress sound waves?

Moe Moe's - Antwoord

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