1 - 2 uren
I received the YLOD after almost 8 years of pretty solid use. The ps3 was turned on probably almost every day since it was originally purposed. The damage was pretty bad. Mainly since I couldn't put the console into high fan mode (holding down the eject button while turning the main power on) to eject the disc. The internals appears relatively clean with very little dust.
For noting: My ps3 is the 2nd gen backward compatible fat version that came with the MGS4 bundle.
I ended up taking the ps3 console apart a total of 4 times.
1) Console tear down to the main internals, but left the pcb inside of the metal plates. Heatsink and fan still attached. I used a air compressor to blow out all of the dust. Reassembled the console, but resulted in continued YLOD.
2) Console tear down and removed the pcb board, fan, and heatsink. I used 99% isotropic alcohol to clean the board and most of the chipsets. Removed all of the hardened thermal paste from the cpu/gpu and heatsink. Applied new thermal past to the cpu/gpu and thermal pads. Reassembled the console, but results again were still YLOD.
3) Console tear down and removed pcb again. This time I used the included heat gun in the ifixit kit for YLOD. Going over the whole board to prevent centralized heat expansion. Then focusing heat on the cpu/gpu for about 1 minute. Removed and reapplied thermal paste to the cpu/gpu again. Reassembled the console, but still resulted in YLOD.
4) Last attempt. Console tear down and removed the pcb board again. This time I removed the heat spreaders from both the cpu/gpu. Using a razor blade to cut the therm paste from the spreaders and the actual die chip. Cleaning up the old thermal paste as usual. The import part here is to use liquid flux. I added some heated up the pcb board again then tilted the board about 45 degrees. Then applied liquid flux (using the pen style) to top side of the cpu/gpu chipsets. Focus on getting the flux under the chip not on top. Using the heat gun again to focus low heat for about 1-2 minutes. This will allow the flux to drain underneath the chip. Do this for all 4 sides of both the cpu/gpu. After applying the flux use the alcohol to clean up any excess flux that remained on the outside of the chips. Applied new thermal paste and put back on the heat spreaders. Applied new thermal paste to the heat speaders and heatsinks again. Reassembled and finally the ps3 turned back on.
The guide should be updated to include the possible need/use of liquid flux. It worked wonders for me. Also, there should be some clarification on using both liquid no clean liquid flux vs. the paste kind. I personally used the liquid version, but I am sure there is a place and time for the paste type.