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The next piece out is the processor and GPU heat sink and exhaust air vent assembly. By pushing the air through a restriction before it gets to the outermost vents, you introduce an additional pressure drop (due to fluid shear stress at the walls) that accelerates the air and pushes it out of the computer faster. With that last obstacle out of the way, the logic board comes out fairly effortlessly.

  • The next piece out is the processor and GPU heat sink and exhaust air vent assembly.

  • By pushing the air through a restriction before it gets to the outermost vents, you introduce an additional pressure drop (due to fluid shear stress at the walls) that accelerates the air and pushes it out of the computer faster.

  • With that last obstacle out of the way, the logic board comes out fairly effortlessly.

Pezzo successivo, il gruppo del dissipatore e dello scarico dell'aria di processore e GPU.

Spingere l'aria attraverso la fessura prima che raggiunga le uscite più esterne, significa aumentare il calo di pressione che accelera l'aria e la spinge più rapidamente fuori dal computer.

Una volta rimosso l'ultimo ostacolo presente lungo il percorso, la scheda logica fuoriesce senza alcuna particolare difficoltà.

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