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With all shields down, we can get a better look at the silicon hiding beneath:
  • With all shields down, we can get a better look at the silicon hiding beneath:

  • Samsung K3LK4K40BM-BGCN 12 GB LPDDR5 RAM layered over Qualcomm 865 SoC

  • Samsung KLUDG4UHDB-B2D1 128 GB UFS 3.0 flash storage

  • Qualcomm SDX55M 2nd-gen 5G modem

  • Skyworks SKY58210-11 RF Front-End Module

  • Qorvo QM78092 Front-End Module

  • Maxim MAX77705C power management IC

  • Qualcomm QPM5677 and QPM6585 5G power amplification modules

拆下所有屏蔽罩后,我们可以好好看看藏在后面的硅片了:

Samsung K3LK4K40BM-BGCN 12 GB LPDDR5 RAM 封装在 Qualcomm 865 SoC 下

Samsung KLUDG4UHDB-B2D1 128 GB UFS 3.0 闪存

Qualcomm SDX55M 第二代 5G 模组

Skyworks SKY58210-11 无线射频前端模组

Qorvo QM78092 前端模组

Maxim MAX77705C 电源管理 IC

Qualcomm QPM5677 和 QPM6585 5G 功率放大模组

Je bijdragen zijn gelicenseerd onder de open source Creative Commons licentie.