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Stap 8
More chips inside this silicon sandwich include:
  • More chips inside this silicon sandwich include:

  • Qualcomm PM8150 power management IC

  • Qualcomm WCD9341 audio codec

  • 2MIWO4

  • Samsung S2DOS04 DC-DC converter (likely for the backlight)

  • Qualcomm QDM3870 RF front-end module

  • Samsung S2MPB02 power management IC

  • Likely a Texas Instruments TAS2xxx audio amplifier

Nog meer chips in deze siliconensandwich:

Qualcomm PM8150 power management ICs

Qualcomm WCD9341 audio codec IC

2MIWO4

DOS04 09Y44E W1948 (waarschijnlijk een backlight IC)

Qualcomm QDM3870 RF front-endmodule

[* black] More chips inside this silicon sandwich include:
[* red] Qualcomm PM8150 power management ICsIC
[* orange] Qualcomm WCD9341[link|https://www.qualcomm.com/products/wcd9341|WCD9341|new_window=true] audio codec IC
[* red] Qualcomm PM8150 power management ICsIC
[* orange] Qualcomm WCD9341[link|https://www.qualcomm.com/products/wcd9341|WCD9341|new_window=true] audio codec IC
[* yellow] 2MIWO4
[* green] DOS04 09Y44E W1948Samsung S2DOS04 DC-DC converter (likely a backlight ICfor the backlight)
[* green] DOS04 09Y44E W1948Samsung S2DOS04 DC-DC converter (likely a backlight ICfor the backlight)
[* light_blue] Qualcomm QDM3870 RF front-end module
[* blue] Samsung S2MPB02 power management IC
[* violet] Likely a Texas Instruments TAS2xxx audio amplifier

Je bijdragen zijn gelicenseerd onder de open source Creative Commons licentie.