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Waarschuwing: Je bewerkt nu een vooraf vereiste handleiding van de handleiding die je net bekeek. Alle wijzigingen die je hierin maakt, beïnvloeden alle 16 handleidingen die deze stap bevatten.

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Stap 3 vertalen

Stap 3
Insert a spudger underneath the shield plate along the edge of the device. Pry up to lift the shield plate up. You may feel a bit of resistance. This is normal, since the shield plate is slightly bonded to the heat sink with thermal paste.
  • Insert a spudger underneath the shield plate along the edge of the device.

  • Pry up to lift the shield plate up.

  • You may feel a bit of resistance. This is normal, since the shield plate is slightly bonded to the heat sink with thermal paste.

  • Remove the shield plate.

  • A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro during reassembly.

Steek een spudger langs de zijkant van het toestel onder het warmteschild.

Duw je tool omlaag om het warmteschild omhoog te wrikken.

Het kan zijn dat je wat weerstand voelt. Dit is normaal, aangezien het warmteschild lichtjes aan het koellichaam is bevestigd door middel van thermische pasta.

Verwijder het warmteschild.

Verwijder de oude thermische pasta van het warmteschild en het koellichaam door middel van wat hooggeconcentreerde isopropyl alcohol (>90%) en een stofvrij stuk doek. Breng nieuwe thermische pasta aan op het koellichaam voordat je je toestel weer in elkaar zet.

[* black] Insert a spudger underneath the shield plate along the edge of the device.
[* icon_reminder] Pry up to lift the shield plate up.
[* icon_note] You may feel a bit of resistance. This is normal, since the shield plate is slightly bonded to the heat sink with thermal paste.
[* black] Remove the shield plate.
[* icon_reminder] Clean offA thick pink thermal compound bridges the old thermal paste fromgap between the shield plate and the copper heat sink using high-concentration (90% or higher) isopropyl alcohol and a microfiber cloth. [guide|744|Apply new thermal paste|new_window=trueunderneath. For best results, whenever the shield plate is removed, refer to our [guide|744|thermal paste guide|new_window=true] to remove the heat sink beforeold thermal compound and replace it with an appropriate, thick compound such as [https://www.amazon.com/viscous-thermal-paste-replacement-Aspire/dp/B01GQ7TFTM/ref=sr_1_4?ie=UTF8&qid=1508975365&sr=8-4&keywords=k5+pro&tag=ifixitam-20|K5 Pro|new_window=true] during reassembly.
[* icon_reminder] Clean offA thick pink thermal compound bridges the old thermal paste fromgap between the shield plate and the copper heat sink using high-concentration (90% or higher) isopropyl alcohol and a microfiber cloth. [guide|744|Apply new thermal paste|new_window=trueunderneath. For best results, whenever the shield plate is removed, refer to our [guide|744|thermal paste guide|new_window=true] to remove the heat sink beforeold thermal compound and replace it with an appropriate, thick compound such as [https://www.amazon.com/viscous-thermal-paste-replacement-Aspire/dp/B01GQ7TFTM/ref=sr_1_4?ie=UTF8&qid=1508975365&sr=8-4&keywords=k5+pro&tag=ifixitam-20|K5 Pro|new_window=true] during reassembly.

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