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During reassembly after installing the new DLP chip, it is recommended that you remove the old thermal paste from the DLP heat sink with a thermal compound remover and purifier.

After removing the thermal compound, apply a small amount of new thermal compound (about the size of a grain of rice) and use a card to apply it evenly over the surface of the heat sink that will be in contact with the chip. This will improve the cooling of the chip during use and will prevent overheating that caused failure of the old chip.

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