Wijzigingen aan stap #19
Bewerking door Miroslav Djuric —
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Stap regels
| [* black] So many chips…where's the dip?: |
| [* red] [http://www.skyworksinc.com/Product.aspx?ProductID=451|Skyworks 77449] Power Amplifier Module for LTE/EUTRAN Bands XIII/XIV |
| [* orange] [http://www2.electronicproducts.com/Motorola_Xoom_MZ600-whatsinside_text-111.aspx|Toshiba Y9A0A111308LA] Memory Stack |
| [* yellow] ST Ericsson CPCAP 6556002 |
| [* green] Hynix H90H1GH51JMP (similar to [guide|7099|other devices|stepid=30262] we've seen, this POP chip sits on top of the TI OMAP 4430 processor) |
| [* blue] Infineon 5726 SLU A1 H1118 3A126586 |
| [* violet] Bosch 2133 C3H L1ABG accelerometer |
| [* black] And the back of the board? Even the PCB is stepped with a cavity to recess the flex wrap from back to front. Nothing spared in the pursuit of ultimate thinness. |
| [* black] And the back of the board? Even the PCB is stepped with a cavity to recess the flex wrap from back to front. Nothing spared in the pursuit of ultimate thinness. |