Wijzigingen aan stap #2
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Stap regels
| [* black] Repeat the previous step to clean and remove all the old liquid metal and its residue from the APU. | |
| [* icon_caution] Don't let any of the liquid metal drip onto the board. | |
| - | [* icon_note] DURING ***DISASSEMBLY*** GOOD POINT TO REPLACE THERMAL PADS ON THE BOTTOM OF THE BOARD/BOTTOM SHIELD PLATE |
| + | [* black] During ''disassembly'' this is a good point to replace any thermal pads on the ''bottom'' of the main board, if necessary. The pads may be stuck to the both bottom shield plate and the main board. |
| + | [* icon_caution] It's important that the replacement pads are the ''same thickness as the originals'', otherwise the foam around the APU may not seal properly. |