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Wijzigingen aan stap #39

Bewerking door Robert Boyd

Bewerking goedgekeurd door Robert Boyd

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Stap regels

-[* black] Insert an opening pick near the bottom of the logic board and pry up with an even force to peel it away from the rear case.
- [* icon_caution] Bending or warping the logic board could lead to permanent damage. If the adhesive becomes difficult to separate, reapply heat to the logic board.
+[* black] Insert an opening tool near the bottom of the logic board and pry up with an even force to peel it away from the rear case.
+ [* icon_caution] Bending or warping the logic board could lead to permanent damage. If the adhesive feels extra stubborn, apply more heat and try again.