Wijzigingen aan stap #6
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Bewerking goedgekeurd door Tobias Isakeit
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| [* black] And on the ~~even darker~~ rear side, a huge expanse of copper conceals these tiny bits of silicon: | |
| - | [* red] [link|https://www.qualcomm.com/products/snapdragon-888-5g-mobile-platform|Qualcomm SM8350 Snapdragon 888 (5 nm)|new_window=true] with integrated X60 modem, layered underneath LPDDR5 3200MHz |
| + | [* red] [link|https://www.qualcomm.com/products/snapdragon-888-5g-mobile-platform|Qualcomm SM8350 Snapdragon 888 (5 nm)|new_window=true] with integrated X60 modem, layered underneath Samsung K3LK7K70BM-BGCP 16 Gb LPDDR5 3200MHz |
| [* orange] SK Hynix HN8T05BZGK 128GB flash memory chip UFS 3.1 | |
| [* green] Wi-Fi/BT 5.2 WCN 6851 Wi-Fi 6 wireless combo SoC | |
| [* yellow] Qualcomm SDR868-RF transceiver chip | |
| [* light_blue] Qualcomm SMB1396 fast charging chip | |
| [* blue] Nuvolta NU1619A wireless power receiving chip | |
| [* violet] Qorvo QM77033D front-end module |