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Wijzigingen aan stap #5

Bewerken voor Tobias Isakeit —

Bewerking goedgekeurd door Tobias Isakeit

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-[* black] Everything exciting on these [link|https://youtu.be/F157geaXp_w?t=3|dark boards|new_window=true] is covered under persistent VC heat sinks which were additionally treated with copper foil (not to forget graphite, thermal oil and aerogel).
-[* black] We fight our way through them accepting to break off a decent amount of tiny resistors along the way:
-[* red] Qualcomm PM8350 PMIC, Qualcomm PM8350C PMIC, PM8350BH
-[* orange] Silicon Mitus-SM3010B-display power management chip
-[* yellow] WCD9380
-[* green] Lionsemi LN8282 Wireless Charging Management Chip
-[* light_blue] Qorvo QM77040 Front-End Module
+[* black] Everything exciting on these [link|https://youtu.be/F157geaXp_w?t=3|dark boards|new_window=true] is covered by heat dissipating copper or graphite foils.
+[* black] We brute-force our way beyond those shields accepting some MINOR damage along the way and find these chips:
+ [* red] Qualcomm PM8350 PMIC, Qualcomm PM8350C PMIC, PM8350BH
+ [* orange] Silicon Mitus-SM3010B-display power management chip
+ [* yellow] WCD9380
+ [* green] Lionsemi LN8282 Wireless Charging Management Chip
+ [* light_blue] Qorvo QM77040 Front-End Module