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[* black] Just because this isThe Murata Wi-Fi SoC module actually comprises of a Broadcom BCM4334 package in addition to an A6 teardown doesn't mean there isn't any room for bonus chips!oscillator, capacitors, resistors, etc.
[* black] Then, they assemble all the components together and send their package to Foxconn, where it eventually ends up on the iPhone. Chipworks said it best: "Murata makes a house that is full of other people's furniture."

[* black] Here are the die images for the Broadcom BCM4334 Wi-Fi (802.11 a/b/g/n) SoCBCM4334, fabricated in Taiwan at [http://en.wikipedia.org/wiki/TSMC|TSMC] on a 40 nm CMOS process. Its key features:
[* red] Wi-Fi (802.11 a/b/g/n)
[* orange] Bluetooth 4.0!
[* black] Just because this isThe Murata Wi-Fi SoC module actually comprises of a Broadcom BCM4334 package in addition to an A6 teardown doesn't mean there isn't any room for bonus chips!oscillator, capacitors, resistors, etc.
[* black] Then, they assemble all the components together and send their package to Foxconn, where it eventually ends up on the iPhone. Chipworks said it best: "Murata makes a house that is full of other people's furniture."

[* black] Here are the die images for the Broadcom BCM4334 Wi-Fi (802.11 a/b/g/n) SoCBCM4334, fabricated in Taiwan at [http://en.wikipedia.org/wiki/TSMC|TSMC] on a 40 nm CMOS process. Its key features:
[* red] Wi-Fi (802.11 a/b/g/n)
[* orange] Bluetooth 4.0!