cause of cracked components on board
Hi, I purchased a dead iphone 5 logic board from ebay to practice on before attempting to repair a black screen on another ebay purchase. After removing the shields and taking a look at the components that were under it, a number of them have physical damage. As I have no history on the board, this is either due to what happened to it before I started on it - or from the shield removal. The shields were removed with hot air at 450c and came off with no apparent problems in less than 60 seconds. There were a couple of cracking noises during the removal but according to a youtube demo I had watched, this is a normal sound as the shields separate.
Can the heat of shield removal do this or is that just not how it works, so it will more likely be damage from prior. Before starting on the other board, I really want to understand this.
Please refer to the attached photos.
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